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This Specification provides the dimensional requirements for plastic and metal wafer carriers used for the processing and handling of 3 in
2 The purpose of this calibration is to ensure that different SSISs of a given manufacturer and model will assign the same light scattering equivalent (LSE) diameter to a specific localized light scatterer (LLS)
SEMI MF110 — Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique
これらの規格化された材料は，太陽電池向けのシリコンウェーハを製造するために使われる単結晶インゴット成長やキャスティングあるいは多結晶シリコン成長の他の方法に対して向けられている。
and for materials acceptance purposes
E12200 - SEMI E122 - テスト装置の特定装置モデル（TSEM）のスタンダード StdPbc-0214 This Specification provides the dimensionalGlobal Information and Control CommitteeNorth American Information and Control Committee20021122North American Regional Standards Committee20031www. semi. org20033 SEMI E12220037SEMIE122. 1 200330303SEMI E30. 3 TSEMTSEM Subordinate Document: SEMI E122. 1 0703 (Reapproved 1109) TSEMSECS II Referenced SEMI Standards SEMI E5 SEMI Equipment Communications Standard 2 Message Content (SECS II) SEMI E30 Generic Model for Communications and Control of